Copper-clad laminates

CGS-500A

  • Copper-clad laminates
  • High Frequency Type
  • UL Standard
  • ROHS Directive

overview

This is a copper-clad laminate with fluoroplastic-impregnated glass cloth as the dielectric.While retaining the properties of fluoroplastic, it has a stable dielectric constant over a wide frequency range and an extremely small dielectric tangent in the high frequency range.

Applications

Satellite communications/Satellite broadcasting/Various mobile communication systems/ETC and AHS in ITS/WLL/Ectenar/Satellite-mounted equipment, etc.

structure

Features

●This substrate has an even lower dielectric constant than CGP.
●The dielectric constant is 2.15.

Dimensions

Nominal thickness (mm) Thickness Tolerance Dielectric constant Dielectric tangent
1020×1220 510×1220 300×300
0.4 ±0.05 ±0.04 2.15 <0.0015
0.5 ±0.05 ±0.04
0.6 ±0.06 ±0.05
0.8 ±0.08 ±0.05
1.0 ±0.10 ±0.08
1.2 ±0.12 ±0.10
1.6 ±0.20 ±0.16

*CGS-500A is a UL certified product.
*The standard tolerance for dielectric constant is ±0.05.

*The standard copper foil is 1/2 oz. or 1 oz. electrolytic copper foil on both sides. If you require electrolytic copper foil of other thicknesses, single-sided copper foil, rolled copper foil, or special dimensions, please contact us separately.

Nominal Thickness purity
1/3oz 0.012mm ±0.003 Over 99.8%
1/2oz 0.018mm ±0.005
1oz 0.035mm +0.010
-0.005
2oz 0.070mm +0.018
-0.008

Characteristics table

Test items Test condition Measurement value (0.8mm thickness)
specific gravity A 2.2
Volume resistivity (Ω cm) A 1015
C-96/40/90 1014
Surface resistivity (Ω) A 1014
C-96/40/90 1013
Insulation resistance (Ω) A 1013
D-2/100 1013
Linear expansion coefficient (ppm/°C) -60°C to 150°C 40
Peel strength (kN/m) A 1
200°C
atmosphere
0.5
Bending strength (N/ mm2) A 50
Water absorption rate 0.01
chemical resistance Excellent
Combustion quality Non-flammable

*Peel strength is measured for 1 oz copper foil (0.035 mm).

Contact Us

Please feel free to contact us with any inquiries, questions, or requests for information.