We exhibited at Printed Wiring Board EXPO 2023!
Thank you very much for always visiting our website.
It was held at Tokyo Big Sight from Wednesday, January 25th to Friday, January 27th, 2023.
Thanks to everyone, the Printed Wiring Board EXPO (within NEPCON Japan) was a great success.
The exhibition was a great success.
Thank you very much.
We will continue to do our utmost to meet your expectations in the future.
We appreciate your continued patronage.
[Products exhibited this time]
● Glass cloth-fluoroplastic baseBoard "xCCF-500"
This is a copper-clad laminate of filled fluoroplastic (PTFE) film with excellent dielectric properties.
It is double-sided copper-clad using ultra-low-density foil. It has excellent flexibility and is ideal for use as a millimeter-wave communication board.
Click here for more details.
● fluoroplastic-impregnated glass cloth millimeter wave compatible board "xCGN-500"
This is a copper-clad laminate made of special glass cloth impregnated with fluoroplastic.
By combining copper foil with low roughness and low dielectric glass cloth, transmission loss is lower than that of conventional products.
For more information, please click here
● fluoroplastic hybrid compatible circuit board "xCH3008H"
Compared to conventional fluoroplastic substrates (CGP-500A), the dielectric tangent and linear expansion coefficient are lower,
This board can also be bonded to different types of boards such as FR4.
Click here for more details.
● Thermal conductive fluoroplastic substrate "xCH3502B"
This board has improved thermal conductivity compared to conventional fluoroplastic boards (CGP-500A).
As an exhibit, we exhibited a substrate laminated with aluminum material, which has high thermal conductivity.
Click here for more details.
- "Radiative heat dissipation sheet" is a heat diffusion sheet that uses infrared conversion and can be attached
This product is made by coating one side of an aluminum film with high thermal conductivity with a heat dissipation paint that has a high emissivity, and applying adhesive to the other side.
It converts heat into infrared rays and radiates it. It is very thin compared to heat sinks, making it ideal for heat countermeasures in places with limited space.
Please check this out for details.
Highly heat-resistant and highly transparent PEEK film adhesive tape for reflow "xACH-5101"
This adhesive tape has a highly transparent PEEK film coated on one side with a mildly adhesive, highly heat-resistant silicone adhesive.
In addition to the high heat resistance of PEEK film, its high transparency allows for reflow and visual inspection after masking.
Please check this out for details.
