CHUKOH Journal

Thank you for attending COMNEXT2023

  • event
  • 2023/07/05

Thank you very much for always visiting our website.
It was held at Tokyo Big Sight from Wednesday, June 28th to Friday, June 30th, 2023.
COMNEXT2023 was a success thanks to all of you.
The exhibition was a great success.
Thank you very much.

We will continue to do our utmost to meet your expectations in the future.
We appreciate your continued patronage.


[Products exhibited this time]

■Millimeter-wave compatible fluoroplastic substrate

"xCH3008H" DK:3 DF: 0.0011 (glass cloth type)

This board uses ultra-low roughness copper foil to reduce transmission loss while providing high adhesion.
We exhibited a hybrid board made of xCH3008H and a different type of board (FR4).
Water absorption rate: 0.014%

 

"xCCF-500" DK:3 DF:0.0013 (without glass cloth)

This board has a special fluoroplastic core and low-roughness copper foil on both sides, providing high adhesion.
Water absorption rate: 0.09%

 

"xCCF-500" DK:3 DF:0.0013 (without glass cloth)

This is a high frequency compatible flexible board made of fluoroplastic.
This board uses fluoroplastic, which has excellent dielectric properties, and has low transmission loss in the millimeter wave band.
Water absorption rate: 0.1%

 

"xCGN-500" DK:2.17 DF:0.0003(glass cloth type)

By combining copper foil with a low roughness and special glass cloth impregnated with fluoroplastic,
This board has lower transmission loss than conventional products.
Water absorption rate: 0.003%

 

Thermally conductive fluoroplastic substrate for RF

"xCH3512B" DK:3.48 DF:0.001

This board has improved thermal conductivity compared to our previous model "CGP-500A".
Laser flash method:
0.623W/m・K
We will be exhibiting a circuit board made by bonding xCH3502B to an aluminum plate.

 

"Radiative heat dissipation sheet" is a heat diffusion sheet that can be attached by infrared conversion

This product is made by coating one side of an aluminum film with high thermal conductivity with a heat dissipation paint that has a high emissivity, and applying adhesive to the other side.
It converts heat into infrared rays and radiates it
.
It is extremely thin compared to heat sinks, making it ideal for heat management in places with limited space.

[Exhibition venue]

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