Thank you very much for always visiting our website.
It was held at Tokyo Big Sight from Wednesday, June 26th to Friday, June 28th, 2024.
COMNEXT2024 was a success thanks to all of you.
The exhibition was a great success.
Thank you very much.
We will continue to do our utmost to meet your expectations in the future.
We appreciate your continued patronage.
[Products exhibited this time]
■ Flexible circuit board"xCCF-280"
This is a flexible printed circuit board with excellent dielectric properties, made by laminating ultra-low roughness copper foil onto an inorganic-filled fluoroplastic film.
It has a low linear expansion coefficient and a low dielectric tangent.
■Low dielectric tangent fluoroplastic substrate "xCGN-500"
By combining copper foil with a low roughness and special glass cloth impregnated with fluoroplastic,
This board has lower transmission loss than conventional products.
■ Thick PTFE porous film "SEF-1000"
A thick PTFE porous film with an air layer that reduces dielectric loss.
■"Radiative Heat Dissipation Sheet PAL-350A" is a heat diffusion sheet that uses infrared conversion and can be attached.
This product is made by coating a highly thermally conductive aluminum film with a highly heat-dissipating paint that has a high emissivity, and processing it into tape.
Heat is converted into infrared rays etc. and dissipated.
It is extremely thin compared to heat sinks and is ideal for heat management in places with limited space.
[Exhibition venue]
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