Thanks to everyone, the 2nd 5G/IOT Communication Exhibition was held at the Tokyo Big Sight Aomi Building from Wednesday, July 17th to Friday, July 19th, 2019.
The exhibition was a great success.
Thank you very much.
The products that were especially popular at the exhibition were"Millimeter-wave compatible circuit board fluoroplastic copper-clad laminate CH-2868D"is.
For many years, we have been manufacturing copper-clad laminates that combine fluoroplastic, which has excellent dielectric properties, with glass cloth.
As we move towards the era of 5G and high-speed, large-capacity communications, we expect demand for our copper-clad laminates to continue to grow.
The product developed there is"Millimeter-wave compatible circuit board fluoroplastic copper-clad laminate CH-2868D".
Features of CH-2868DUnroughened foilThe following is adopted:
We've also got a detailed video introduction, so be sure to check it out!
