Thank you very much for always visiting our website.
It was held at Tokyo Big Sight from Wednesday, January 19th to Friday, January 21st, 2022.
NEPCON JAPAN (Printed Wiring Board EXPO) was a great success thanks to everyone.
The exhibition was a great success.
Thank you very much.
We will continue to do our utmost to meet your expectations in the future.
We appreciate your continued patronage.
[Video aboutthe exhibited product: mm-wave compatible low dielectric substrate]
[Products exhibited this time]
●Flexible circuit board xCCF-500
This is a high frequency compatible fluoroplastic (PTFE) flexible board.
This board uses fluoroplastic, which has excellent dielectric properties, and has low transmission loss in the millimeter wave band.
●Multilayer board
This is a multi-layer board made of fluoroplastic (PTFE).
By using multiple layers, it is possible to make the product smaller and lighter.
●C-Porous™ Porous Products
This is a product made by making PTFE porous.
We exhibited porous films and porous tubes with low dielectric properties.
●Orange fluoroplastic products
Orange fluoroplastic tube and fluoroplastic adhesive tape.
It is ideal for identifying high-voltage wiring in electric vehicles (EVs), which are required to be identified in orange.
[Exhibition venue]
